发明名称 |
COMPOSITIONS AND METHODS FOR REMOVING CERIA PARTICLES FROM A SURFACE |
摘要 |
A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The removal compositions include at least one surfactant. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials. |
申请公布号 |
WO2014186538(A1) |
申请公布日期 |
2014.11.20 |
申请号 |
WO2014US38125 |
申请日期 |
2014.05.15 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
LIU, JUN;SUN, LAISHENG |
分类号 |
C11D3/26;C09K3/14;C11D1/00;C11D3/00 |
主分类号 |
C11D3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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