| 摘要 |
<p>In order to enable the wraparound of sputtering material on a protective coat to be reliably prevented in a simple manufacturing step, a method for manufacturing a chip resistor (1) involves a previous step in which end surface electrodes (8) are formed, wherein a masking material (11) is formed on an overcoat (a protective coat) (7) in such a manner as to avoid a recess (7a), which is where a trimming groove (10) is formed, and the masking material (11) is removed by ultrasonic cleaning after the sputtering of the end surface electrodes (8).</p> |
