| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation member capable of positively dissipating heat accumulated in a heat storage material to the outside from the surface of a housing while preventing the temperature rise on the surface of the housing and an electronic apparatus.SOLUTION: The heat dissipation member includes: a heat release surface which is joined to or faces the inner face of the housing of an electronic apparatus; an endothermic surface formed at the rear side of the heat release surface, which is joined to or faces the electronic component in the housing; and a lamination including in each layer a heat storage material which phase-changes from the solid state to the liquid state due to the heat of the electronic component forming between the heat release surface and the endothermic surface. |
