| 摘要 |
<p>PROBLEM TO BE SOLVED: To separate a thin substrate from a support substrate easily without difficulty by vacuum break.SOLUTION: By removing at least a part of the sealant 3 of a bonding substrate 4 under atmospheric pressure, airtightness of a vacuum space S, where vacuum state has been kept on the inside of the sealant, is broken and the fluid of air or liquid flows into the vacuum space at once thus opening the vacuum space to the atmosphere. Consequently, the sealant is pushed by both the external pressure of the atmosphere and the internal pressure of the fluid entering the vacuum space, and is made thin thus allowing easy peeling of the thin substrate 1 from the support substrate 2 without difficulty.</p> |
