SEMICONDUCTOR ELEMENT WITH BUMP AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element with a bump which is less affected by undercutting, and a method for manufacturing the same.SOLUTION: A semiconductor element includes: a metal wiring arranged on a substrate; a barrier metal layer and a seed metal layer formed on a passivation layer with an opening through which a part of an upper surface of the metal wiring is exposed; a first plating layer formed on the seed metal layer and having a hem protruding from a side surface thereof; and a second plating layer formed on the first plating layer. A method for manufacturing the semiconductor element includes the steps of: forming a photoresist pattern having a side recess on the seed metal layer; and forming a plating layer having a hem in which the side recess is embedded by performing plating.