PREPREG, METAL-CLAD LAMINATE, PRINTED CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit substrate having fine circuit dimension and excellent insulation reliability and a prepreg capable of providing a semiconductor package with reduced warpage.SOLUTION: A prepreg 100 is obtained by impregnating at least two layers of a resin composition containing thermosetting resin and inorganic filler in a fiber substrate 101. In the prepreg, at least one of a first resin layer 103 from one surface 108 to the fiber substrate and a second resin layer 105 from the other surface 109 of the prepreg to the fiber substrate contains naphthylene ether type epoxy resin represented by the general formula (1). In the prepreg, when a distance between the one surface and a center line A1 of the fiber substrate is set to D1 and a distance between the other surface and the center line A1 of the fiber substrate is set to D2, D2>D1 is satisfied.