发明名称 PLATING DEVICE
摘要 Disclosed is a plating device that has a plating tank that retains a plating fluid and carries out magnetic metal plating on a shaft shaped member immersed in the plating fluid as a negative electrode. The plating device is provided with: a plurality of shielding jigs that are fitted to the outer peripheral surface of the shaft shaped member and regulate the part of the shaft shaped member being plated; and a positive electrode provided in the vicinity of the shaft shaped member and having an output part that faces the part being plated. A center position in the axial direction of the shaft shaped member for the part being plated and a center position of the output part are aligned within a prescribed allowable value for the center positions.
申请公布号 US2014339077(A1) 申请公布日期 2014.11.20
申请号 US201214371638 申请日期 2012.12.21
申请人 HONDA MOTOR CO., LTD. 发明人 Arimura Yutaka;Shimizu Yasuo;Yoneda Atsuhiko
分类号 C25D21/12;C25D3/56;C25D17/06 主分类号 C25D21/12
代理机构 代理人
主权项 1. A plating device comprising a plating tank retaining a plating fluid, the device being used to carry out magnetic alloy plating of a shaft-shaped member immersed in the plating fluid, the shaft-shaped member serving as a negative electrode, wherein the plating device includes a plurality of shielding jigs fitted about an outer peripheral surface of the shaft-shaped member and defining a plated portion on the shaft-shaped member; and a positive electrode disposed surrounding the shaft-shaped member, and having an output portion facing the plated portion; characterized in that the center position of the plated portion and the center position of the output portion in the axial direction of the shaft-shaped member are aligned to within a predetermined tolerance relating to the center position.
地址 MINATO-KU, TOKYO JP