| 摘要 |
<p>An implantable medical device lead includes a lead body including a lumen extending from a proximal end of the lead body to a distal end of the lead body, and a helically coiled conductor including one or more filars extending through the lumen and including a plurality of turns. The implantable medical device lead further includes an insulative coating on at least one of the one or more filars, the insulative coating circumferentially covering the outer surface of the at least one of the one or more filars, and at least one cohesive structure formed between adjacent turns of the helically coiled conductor. The at least one cohesive structure includes portions of the insulative coating on the at least one of the one or more filars and is configured to interconnect adjacent turns of the helically coiled conductor.</p> |
