| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a laminated wafer capable of dividing a laminated wafer appropriately, and to provide a pressure-sensitive adhesive sheet for use in the processing method of a laminated wafer.SOLUTION: A processing method of a laminated wafer includes a pressure-sensitive adhesive sheet sticking step for sticking a pressure-sensitive adhesive sheet (14) to the chip (12) side of a laminated wafer (2), and a division step for dividing a wafer along a dividing line (10) from the reverse side (4b) of a wafer (4) of the laminated wafer (2). The pressure-sensitive adhesive sheet has a base material layer (16a), a glue layer (16b) provided on the base material layer, and a protrusion (18) provided corresponding to the outer peripheral excessive region (8) of the laminated wafer and having an upper surface exhibiting adhesiveness for the wafer. In a state where a chip of the laminated wafer is stuck to the glue layer of the pressure-sensitive adhesive sheet, and the outer peripheral excessive region is supported by the protrusion, the division step for dividing the laminated wafer is performed. |
