| 主权项 |
1. A method for manufacturing a semiconductor device comprising:
bringing a semiconductor substrate and a transparent stamper into contact with each other by a coating layer comprising an uncured ultraviolet-curable resin material for pattern transfer containing isobornyl acrylate, an acrylate having a fluorene skeleton represented by formula (1), a polyfunctional acrylate, and a polymerization initiator, the coating layer being interposed between the semiconductor substrate and the transparent stamper,wherein each of R1 and R2 is selected from the group consisting of H, —C2H4—OCOCH═CH2, —C3H6—OCOCH═CH2, —CH4H8—OCOCH═CH2,and each of R3 and R4 is selected from the group consisting of H, —CH3, —C2H5, —C3H7, —C4H9, —Cl, —F, —Br, —NH2, —OH, and —OCOCH═CH2;
irradiating the coating layer with ultraviolet light, thereby curing the ultraviolet-curable resin material for pattern transfer; and removing the transparent stamper to form, on one surface of the semiconductor substrate, a cured ultraviolet-curable resin material layer for pattern transfer onto which a three-dimensional pattern is transferred. |
