PACKAGE STACKS AND METHODS OF MANUFACTURING THE SAME

摘要

A package stack includes a first package, a second package, first solder balls and a molding member. The first package includes a first package substrate, a first semiconductor chip on the first package substrate and connecting pads. The second package includes a second package substrate and a second semiconductor chip on the second package substrate. The second package is disposed over the first package. The first solder balls are in contact with the connecting pads and a bottom of a peripheral portion of the second package substrate. The molding member covers an upper surface of the second package substrate and the second semiconductor chip. A portion of the molding member overlapping the first solder balls has a thickness smaller than a thickness of another portion of the molding member.

主权项

1. A method of manufacturing a package stack, the method comprising:
forming a first package, the first package including a first semiconductor chip and connecting pads; forming a second package, the second package including a second package substrate, a second semiconductor chip on the second package substrate and solder balls on a bottom of the second package substrate; forming a molding member, the molding member covering an upper surface of the second package substrate and the second semiconductor chip, wherein a portion of the molding member overlapping the solder balls has a thickness smaller than a thickness of another portion of the molding member; and connecting the solder balls to the connecting pads such that the second semiconductor chip is electrically connected to the first semiconductor chip.