HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER

摘要

A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the first area has a surface with a second wettability that is greater than the first wettability. During bonding, an adhesive material bonding a chip to the substrate spreads among the first area by a downward force placed on the chip. Due to the difference in wettability, the adhesive material then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position. The predetermined position can be determined by substrate protrusions or substrate cavities.

主权项

1. A high power dielectric carrier including a dielectric layer and at least an upper conductive layer, the upper conductive layer comprising:
a first area whose surface has a first wettability, and
a second area, which at least partially surrounds the first area, whose surface has a second wettability greater than the first wettability, such that when a chip is bonded to the upper conductive layer with an adhesive material, the adhesive material spreads among the first area caused by a downward force placed on the chip and then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position.