| 摘要 |
The invention proposes a micromechanical apparatus having a sensor wafer, an intermediate wafer and an evaluation wafer, wherein the micromechanical apparatus has a main plane of extent, wherein the sensor wafer, the intermediate wafer and the evaluation wafer are arranged above one another in such a manner that the intermediate wafer is arranged between the sensor wafer and the evaluation wafer, wherein the evaluation wafer has at least one application-specific integrated circuit, and wherein the sensor wafer and/or the intermediate wafer comprise(s) a first sensor element and the sensor wafer and/or the intermediate wafer comprise(s) a second sensor element which is spatially separated from the first sensor element, wherein the first sensor element is situated in a first cavity formed by the intermediate wafer and the sensor wafer, and the second sensor element is situated in a second cavity formed by the intermediate wafer and the sensor wafer, wherein a first gas pressure in the first cavity differs from a second gas pressure in the second cavity, and the intermediate wafer has, at least at one point, an opening in a direction running perpendicular to the main plane of extent. |
