| 摘要 |
<p>The present invention relates to a large area substrate processing apparatus comprises a reaction chamber; an injector assembly having a first injector module spraying first processing gas by activating the first processing gas and a second injector module spraying second processing gas by being placed apart from the first injector module in a first direction; and an injector moving module having the injector assembly perform a reciprocating motion in the first direction so that a thin film is formed on a substrate by the activated first processing gas and the second processing gas. Accordingly, in progressing processes such as forming a thin film on a large area substrate or the like, it is possible to remove spatial constraints of the reaction chamber due to large scaling of the substrate because the thin film is formed on the substrate as the injector assembly performs a horizontal movement while the substrate is being fixated.</p> |
