| 发明名称 |
PEELING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE PEELING METHOD |
| 摘要 |
The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate. |
| 申请公布号 |
US2014339564(A1) |
申请公布日期 |
2014.11.20 |
| 申请号 |
US201414450927 |
申请日期 |
2014.08.04 |
| 申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
YAMAZAKI Shunpei;TAKAYAMA Toru;MARUYAMA Junya;GOTO Yuugo;OHNO Yumiko |
| 分类号 |
H01L21/70;H01L21/324;H01L27/15;H01L21/28;H01L21/02;H01L21/8234;H01L33/00;H01L21/425 |
主分类号 |
H01L21/70 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. (canceled) |
| 地址 |
Atsugi-shi JP |
