BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

摘要

A bonding method includes: holding a substrate to be processed by a first holding unit; holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate thereon or in a second holding state of electrostatically attracting the glass substrate; depressurizing the interior of a chamber; and bringing the substrate to be processed and the glass substrate into contact with each other and pressing them. Holding a glass substrate includes: switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including a pressure change timing in depressurizing the interior of a chamber and a pressing timing in bonding the substrate to be processed and the glass substrate.

主权项

1. A bonding method, comprising:
holding a substrate to be processed by a first holding unit; holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate on the second holding unit or in a second holding state of electrostatically attracting the glass substrate toward the second holding unit; depressurizing the interior of a chamber for accommodating the substrate to be processed held by the first holding unit and the glass substrate held by the second holding unit; and bringing the substrate to be processed and the glass substrate into contact with each other and pressing the substrate to be processed and the glass substrate to bond the substrate to be processed and the glass substrate, wherein holding a glass substrate includes:
switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including a pressure change timing at which a pressure within the chamber is changed in depressurizing the interior of a chamber and a pressing timing at which the substrate to be processed and the glass substrate are pressed in bonding the substrate to be processed and the glass substrate.