COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD

摘要

Provided is a copper-fine-particle dispersion liquid with which photosintering can be used to form, upon an inorganic base material, a conductive film exhibiting excellent adhesive properties. This copper-fine-particle dispersion liquid (1) includes a dispersion medium and copper fine particles (11). The copper fine particles (11) are dispersed in the dispersion medium. The copper-fine-particle dispersion liquid (1) includes an adhesion improver for improving adhesive properties between a base material, and a conductive film (4) to be formed upon the base material by photosintering the copper fine particles (11). The base material is an inorganic base material (3). The adhesion improver is a phosphorus-containing compound. Accordingly, the adhesion improver improves the adhesive properties between the conductive film (4) and the inorganic base material (3).