发明名称 BONDING METHOD, BONDING DEVICE, AND BONDING SYSTEM
摘要 PROBLEM TO BE SOLVED: To prevent natrium from being deposited from a glass substrate.SOLUTION: A bonding method according to an embodiment includes a first holding step, a second holding step, a temporary bonding step, a temperature-raising step, and a permanent bonding step. The first holding step holds a processed substrate. The second holding step holds a glass substrate by electrostatic attraction. The temporary bonding step temporarily bonds the processed substrate and the glass substrate at an applied pressure lower than a desired applied pressure and a temperature lower than a desired temperature after the first holding step and the second holding step. The temperature-raising step releases electrostatic attraction of the glass substrate and raises the temperature to the desired temperature simultaneously with or after the temporary bonding step. The permanent bonding step permanently bonds the processed substrate and the glass substrate at the desired applied pressure after the temperature-raising step.
申请公布号 JP2014220282(A) 申请公布日期 2014.11.20
申请号 JP20130096605 申请日期 2013.05.01
申请人 TOKYO ELECTRON LTD 发明人 FURUYA GORO;WADA NORIO;OKAWA OSAMU
分类号 H01L21/02 主分类号 H01L21/02
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