发明名称 |
Interconnect Structure for Wafer Level Package |
摘要 |
A package includes a device die having a substrate. A molding compound contacts a sidewall of the substrate. A metal pad is over the substrate. A passivation layer has a portion covering an edge portion of the metal pad. A metal pillar is over and contacting the metal pad. A dielectric layer is over the passivation layer. A package material formed of a molding compound or a polymer is over the dielectric layer. The dielectric layer includes a bottom portion between the passivation layer and the package material, and a sidewall portion between a sidewall of the metal pillar and a sidewall of the package material. A polymer layer is over the package material, the molding compound, and the metal pillar. A post-passivation interconnect (PPI) extends into the polymer layer. A solder ball is over the PPI, and is electrically coupled to the metal pad through the PPI. |
申请公布号 |
US2014339696(A1) |
申请公布日期 |
2014.11.20 |
申请号 |
US201414448356 |
申请日期 |
2014.07.31 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Lin Jing-Cheng;Liu Nai-Wei;Hung Jui-Pin;Jeng Shin-Puu |
分类号 |
H01L23/498;H01L23/48;H01L21/78;H01L23/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
1. A package comprising:
a metal pad over a substrate; a passivation layer extending at least partially over the metal pad; a metal pillar over and electrically coupled to the metal pad; a dielectric layer over the passivation layer; a package material over the dielectric layer, wherein the dielectric layer comprises a bottom portion between the passivation layer and the package material, and a sidewall portion between a sidewall of the metal pillar and a sidewall of the package material; a polymer layer over the package material and the metal pillar; and a post-passivation interconnect (PPI) extending into an opening in the polymer layer and electrically coupled to the metal pillar. |
地址 |
Hsin-Chu TW |