Method for Enhancing the Yield Rate of Ball Implanting of a Substrate of an Integrated Circuit

摘要

A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier.

主权项

1. A ball implanting method, comprising:
a first step of providing a suction fixture which has a plurality of ball grooves and a plurality of through holes each connected to a respective one of the ball grooves; a second step of providing an evacuating device which is combined with the suction fixture and has a plurality of connecting holes each connected to a respective one of the through holes of the suction fixture, a vacuum chamber connected to each of the connecting holes, and an air hole connected to the vacuum chamber; a third step of providing two pivoting and inverting devices which are mounted on the evacuating device; a fourth step of providing a guide plate which has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture; a fifth step of providing a ball carrier which is movably mounted on the guide plate and contains a plurality of solder balls; a sixth step of providing a substrate which has a plurality of soldering pastes; a seventh step of moving the guide plate to abut the suction fixture to connect each of the guide holes to the respective ball groove of the suction fixture; a eighth step of pivoting the suction fixture and the guide plate reciprocally in an inclined manner by the pivoting and inverting devices to move the ball carrier on the guide plate reciprocally and to introduce each of the solder balls through the respective guide hole of the guide plate into the respective ball groove of the suction fixture; a ninth step of drawing air in the vacuum chamber of the evacuating device outward through the air hole of the evacuating device to suck each of the solder balls; a tenth step of moving the guide plate to space from the suction fixture; an eleventh step of inverting the suction fixture by the pivoting and inverting devices until the suction fixture faces the substrate, and each of the solder balls faces and aligns with a respective one of the soldering pastes of the substrate; a twelfth step of moving the substrate to rest each of the soldering pastes on the respective solder ball; a thirteenth step of introducing ambient air through the air hole into the vacuum chamber to release each of the solder balls and to implant each of the solder balls in the respective soldering paste of the substrate; and a fourteenth step of moving the substrate to detach the solder balls from the suction fixture, thereby accomplishing the ball implanting process.