| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a flexible substrate for achieving a mounting structure capable of preventing the flexible substrate from being peeled off from a printed-wiring board.SOLUTION: The mounting method of a flexible substrate includes the steps of: applying anisotropic conductive paste 4 which contains conductive particles and a thermosetting resin to a first region R1 extending in a belt-like shape along an edge 1b separated away from an edge 1b and a second region R2 which extends toward the edge 1b from both ends R1a and R1b in an extending direction of the first region R1 in a mounting area Rm formed along the edge 1b on the surface of the printed-wiring board; placing the flexible substrate on the mounting area Rm so that the flexible substrate extends from the edge 1b in a substantially vertical direction; and pressing the flexible substrate against the printed-wiring board in the mounting area Rm while heating the anisotropic conductive paste 4 applied to the mounting area Rm. |
