| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress migration being generated when ions, contained in a developer for forming a development type solder resist, adhere to the other side of a substrate, in an electronic device where a development type solder resist is provided on one side of the substrate, and a print type solder resist is provided on the other side.SOLUTION: An electronic device includes a substrate 10 having a first conductor layer 13 on one side 11, and a second conductor layer 14 on the other side 12, a development type solder resist 20 provided on one side 11 of the substrate 10, and a print type solder resist 30 provided on the other side 12 of the substrate 10. The print type solder resist 30 contains an ion trap material for trapping ions being contained in the developer when forming the development type solder resist 20.</p> |
