发明名称 TEMPERATURE DETECTING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
申请公布号 US2014342474(A1) 申请公布日期 2014.11.20
申请号 US201414446622 申请日期 2014.07.30
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 KOSUGI Tetsuya;UENO Masaaki;YAMAGUCHI Hideto
分类号 H01L21/66;C23C16/02;G01K13/02 主分类号 H01L21/66
代理机构 代理人
主权项 1. A temperature detecting unit comprising: a vertically extending insulation rod installed in a protection member and having a through-hole therein extending in vertical direction; and a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion protruding from an upper end of the insulation rod, an angled portion protruding from a lower end of the insulation rod and a horizontal portion disposed a rear end of the angled portion elongated in horizontal direction, wherein the horizontal portion is positioned higher than a lowermost end of the angled portion.
地址 Tokyo JP