发明名称 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
摘要 A semiconductor device includes a substrate, a first fin structure, an electrical contact structure and a gate structure. The first fin structure includes a horizontal fin structure extending along a first direction and a vertical fin structure extending along a second direction. The substrate has a first region and a second region. A portion of the horizontal fin structure and the vertical fin structure are disposed in the first region, and the electrical contact structure directly covers the horizontal fin structure and the vertical fin structure within the first region. The gate structure partially overlaps the horizontal fin structure within the second region.
申请公布号 US2014339641(A1) 申请公布日期 2014.11.20
申请号 US201313895367 申请日期 2013.05.16
申请人 UNITED MICROELECTRONICS CORP. 发明人 Hong Shih-Fang;Tsao Po-Chao
分类号 H01L27/088 主分类号 H01L27/088
代理机构 代理人
主权项 1. A semiconductor device comprising: a substrate, having a first region and a second region; a first fin structure, disposed on the substrate, the first fin structure comprising at least a horizontal fin structure extending along a first direction, and a vertical fin structure extending along a second direction, wherein portions of the horizontal fin structure and the vertical fin structure are disposed in the first region; an electrical contact structure, directly covering the horizontal fin structure and the vertical fin structure within the first region; and a gate structure, disposed on the substrate, wherein the gate structure partially overlaps the horizontal fin structure within the second region.
地址 Hsin-Chu City TW