| 摘要 |
The present invention relates to an LED module and an LED lighting device having the same. According to an aspect of the present invention, the LED module comprises: a printed circuit board which has an LED chip mounting location on which an LED heat dissipating hole is formed, and an upper side on which a conductive wire, supplying power to the LED chip, is formed; a heat dissipating plate which is arranged to contact a lower side of the printed circuit board, dissipates heat of the LED chip, and includes LED contact protrusions, which is exposed through the LED hole to an upper part of the printed circuit board and is formed to protrude from a plate surface so as to contact a lower part of the LED chip; and a heat sink which is arranged on a lower part of the heat dissipating plate and dissipates heat, transmitted from the LED chip, to the outside. |
