发明名称 STRUCTURE AND METHOD FOR BONDING WIRE AND TERMINAL
摘要 <p> A structure for bonding a wire and a terminal, in which an exposed core wire (25) of the wire (21) is bonded to the terminal (11); wherein the terminal (11) has a first surface (19) to which the bonding part (28) of the core wire (25) is bonded, and a second surface (17) with which the exposed section (30) of the core wire (25) extending on the base end side of the bonding part (28) is in contact, the first surface (19) and the second surface (17) being formed at different heights.</p>
申请公布号 WO2014185469(A1) 申请公布日期 2014.11.20
申请号 WO2014JP62880 申请日期 2014.05.14
申请人 YAZAKI CORPORATION 发明人 IIZUKA HAYATO;MORI SHIGEO
分类号 H01R4/02;B23K20/10;H01R43/02 主分类号 H01R4/02
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