| 摘要 |
<p>An interface system includes: a first transfer chamber having a closable first transfer opening through which a substrate is transferred between the first transfer chamber and an exposure system and capable of being evacuated to a reduced pressure; a plurality of load-lock chambers each having a second transfer opening through which a substrate is transferred between the load-lock chamber and the first transfer chamber, and a third transfer opening through which a substrate is transferred between the load-lock chamber and the coating and developing system; a plurality of heating modules for heating a substrate, each having a fifth transfer opening through which a substrate is transferred between the same heating module; and a plurality of cooling modules for cooling a substrate, each having a sixth transfer opening through which a substrate is transferred between the same cooling module and the second transfer chamber.</p> |
