PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND SURFACE ROUGHENED COPPER PLATE

摘要

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein.;MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

主权项

1. A device for producing a copper plate with a roughened surface, comprising:
an electrolytic bath for retaining an electroplating copper solution; one pair or a plurality of pairs of positive electrodes arranged in the electrolytic bath to face each other in a tandem arrangement; one pair or a plurality of pairs of negative electrodes arranged in the electrolytic bath to face each other in a tandem arrangement; a negative electrode bus bar arranged horizontally at an upper side between the one pair or the plurality of pairs of the positive electrodes for hanging the copper plate; a positive electrode bus bar arranged horizontally at an upper side between the one pair or the plurality of pairs of the negative electrodes for hanging the copper plate; and an insulating bar for connecting the negative electrode bus bar and the positive electrode bus bar.