| 摘要 |
<p>The present invention relates to a semiconductor test socket. The semiconductor test socket according to an embodiment of the present invention includes; a plurality of unit pattern units arranged in the horizontal direction; and a plurality of insulation sheets which are arranged between a pair of the adjacent unit pattern units to insulate the unit pattern units from each other. The semiconductor test socket according to an embodiment of the present invention can complement the shortcomings of a pogo-pin type or PCR socket type semiconductor test socket. Also, the semiconductor test socket can implement fine patterns and overcome the limitations regarding the thickness of the semiconductor test socket.</p> |
