| 发明名称 |
REMELTING METHOD AND SUBSEQUENT REFILLING AND COMPONENT |
| 摘要 |
A method for re-melting and refilling a defect (7) in a surface (19) of a substrate (4) by re-melting the defect (7) causing a hollow (28) to be produced above the re-melt, and the hollow (28) is refilled. A nickel- or cobalt-based substrate (4) is re-melted by a laser re-melting method. Subsequently, the hollow (28) that is produced is refilled by a laser application method, in particular by soldering. Also, a component having a re-melted region (25) and a solder region (31) thereover is disclosed. |
| 申请公布号 |
US2014339206(A1) |
申请公布日期 |
2014.11.20 |
| 申请号 |
US201214354228 |
申请日期 |
2012.09.14 |
| 申请人 |
Ott Michael;Piegert Sebastian;Reinkensmeier Ingo |
发明人 |
Ott Michael;Piegert Sebastian;Reinkensmeier Ingo |
| 分类号 |
B23P6/00;B23K26/34 |
主分类号 |
B23P6/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for re-melting and filling a defect in a surface of a substrate comprising:
re-melting the substrate at the defect for filling the defect filled by the re-melded material of the substrate, wherein a depression is formed by the re-melting at an outward side of the filled defect; filling the depression which has formed using a soldering or welding process forming a filling region in the depression. |
| 地址 |
Mulheim an der Ruhr DE |
