发明名称 ALUMINUM ALLOY MATERIAL, SINGLE LAYER OF WHICH ALLOWS THERMAL BONDING; MANUFACTURING METHOD THEREFOR; AND ALUMINUM BONDED BODY USING SAID ALUMINUM ALLOY MATERIAL
摘要 This invention provides the following: an aluminum alloy material, a single layer of which allows thermal bonding without the use of a bonding member such as a brazing or welding filler metal; a method for bonding said aluminum alloy material; and an aluminum bonded body using said aluminum alloy material. This invention provides an aluminum alloy material that is characterized by comprising an aluminum alloy that contains silicon in the amount of 1.0-5.0 mass% and iron in the amount of 0.01-2.0 mass%, with the remainder comprising aluminum and unavoidable impurities. Said aluminum alloy material is also characterized in that 10 to 1×104 aluminum-based intermetallics having equivalent circular diameters of 0.01-0.5 µm are present per cubic micrometer and no more than 200 silicon-based intermetallics having equivalent circular diameters of 5.0-10 µm are present per cubic millimeter. This invention also provides the following: a method for manufacturing said aluminum alloy material; and an aluminum bonded body using said aluminum alloy material.
申请公布号 WO2014184880(A1) 申请公布日期 2014.11.20
申请号 WO2013JP63454 申请日期 2013.05.14
申请人 UACJ CORPORATION 发明人 KUROSAKI TOMOHITO;NIIKURA AKIO;TERAYAMA KAZUKO;MURASE TAKASHI;MATSUI YU;MOCHIDUKI JUNICHI;ARAKI TOSHIO
分类号 C22C21/00;C22C21/02;C22F1/00;C22F1/04;C22F1/043 主分类号 C22C21/00
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