发明名称 リジッド−フレキシブル多層配線基板の製造方法
摘要 PROBLEM TO BE SOLVED: To reduce work for removing an unnecessary portion to form a flexible part. SOLUTION: This manufacturing method includes: a process of forming a release layer in a flexible part formation prospective region B<SB POS="POST">2</SB>' on an upper face of a first thermoplastic resin sheet 300Y; and a process of forming a penetrating first cut in a position of a boundary between a rigid part formation prospective region and the flexible part formation prospective region B<SB POS="POST">2</SB>' out of a first closed loop surrounding the rigid part formation prospective region, in the first thermoplastic resin sheet 300Y. The manufacturing method further includes: a process of forming a second cut along a second closed loop surrounding the overall rigid part formation prospective region and flexible part formation prospective region from a second thermoplastic resin sheet 400Y side of a laminated body which is thermally compressed and bonded; and a process of integrally taking out a region surrounded by the first closed loop of the first thermoplastic resin sheet 300Y and a region surrounded by the second closed loop of the second thermoplastic resin sheet 400Y which are integrated by thermocompression bonding by separation using the release layer as a boundary. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5625759(B2) 申请公布日期 2014.11.19
申请号 JP20100245253 申请日期 2010.11.01
申请人 发明人
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
代理机构 代理人
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