| 摘要 |
PROBLEM TO BE SOLVED: To achieve the excellent fluidity of a composition and to achieve reliability in moisture resistance suitable to electronic component-related material of recent years and high flame retardancy without using halogen for environmental harmony. SOLUTION: A thermosetting resin composition is disclosed which contains as essential components, an epoxy resin (A) and a phenolic resin (B). The phenolic resin (B) has a phenol resin structure having as a fundamental skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are linked via bivalent aralkyl groups expressed by general formula 1 (wherein, Ar denotes a phenylene group or a biphenylene group; and R denotes a hydrogen atom or a methyl group, independently), also the aromatic nucleus of the structure has a naphthyl methyl group or an antonyl methyl group, and also, the abundance ratio of the naphthyl methyl groups or the like is the ratio at which the total number of the naphthyl methyl groups or antonyl methyl groups becomes 10 to 200 when the total number of the phenolic hydroxyl group-containing aromatic skeletons (ph) is 100. COPYRIGHT: (C)2012,JPO&INPIT |
