INTEGRATING THROUGH SUBSTRATE VIAS INTO MIDDLE-OF-LINE LAYERS OF INTEGRATED CIRCUITS

摘要

A semiconductor wafer has an integrated through substrate via (TSV). The semiconductor wafer includes a substrate. A dielectric layer may be formed on a first side of the substrate. A through substrate via may extend through the dielectric layer and the substrate. The through substrate via may include a conductive material and an isolation layer. The isolation layer may at least partially surround the conductive material. The isolation layer may have a tapered portion.