| 摘要 |
<p>The present invention provides a protective film for semiconductor wafers which is provided with a base film and a protective membrane formed on the upper side of the base film, wherein the protective film for a semiconductor wafer is characterized in that the protective membrane contains components (A)-(E) below. (A) 100 parts by mass of at least one type of resin selected from the group consisting of phenoxy resins, polyimide resins, and (meth)acrylic resins; (B) 5-200 parts by mass of an epoxy resin; (C) 100-400 parts by mass of a filler other than a fibrous inorganic filler; (D) a catalytic quantity of an epoxy resin curing catalyst; and (E) 25-5000 parts by mass of a fibrous inorganic filler. A semiconductor wafer protective film having excellent cutting properties, and a highly productive method for manufacturing semiconductor chips, are provided thereby.</p> |
