POLYAMIC ACID AND POLYIMIDE

摘要

[Problem] To provide a resin composition for display substrates that is capable of forming a useful polyimide film having high heat resistance, a moderate coefficient of linear expansion, and moderate flexibility. [Solution] This resin composition for display substrates comprises a polyamic acid including a structural unit represented by formula (1) and a structural unit represented by formula (3), or a polyimide including a structural unit represented by formula (2) and a structural unit represented by formula (4). (In formulae (1) to (4): X1 represents a tetravalent organic group having an aromatic group and two carbonyl groups; Y1 represents a divalent aromatic group or aliphatic group; Y2 represents a divalent aromatic group having a fluorene skeleton; and n and m each represent a natural number.)