筐体用材料、当該筐体用材料の製造方法、当該筐体用材料を用いた電子機器用筐体、当該電子機器用筐体の製造方法、当該電子機器用筐体を用いた電子機器

摘要

A casing for electronic equipments is disclosed. The casing includes a first region and a second region. The first region is formed by a foamed layer provided between an outer rigid layer and an inner rigid layer. The foamed layer isolates the outer rigid layer from the inner rigid layer. The second region is formed by a single layer of material, and the single layer of material is joined to the outer rigid layer, the formed layer and the inner rigid layer.