| 摘要 |
[PROBLEMS] To provide a method and an apparatus for applying a liquid material, which do not require complicated parameter calculation and flexibly correspond to discharge quantity change, and to provide a program. [MEANS FOR SOLVING PROBLEMS] In a liquid material applying method, an entire application pattern composed of a non-correcting application pattern along the outer circumference of a work and a correcting application pattern overlapping the non-correcting application pattern is formed, and based on the entire application pattern, the liquid material is discharged from a discharge section. Then, the liquid material is applied into a gap between a substrate and the work placed on the substrate by using capillary phenomenon. The correcting application pattern is composed of an application area and a non application area, and a liquid material discharge quantity is corrected by increasing and reducing the application area and the non application area of the correcting application pattern. |
