发明名称 ポリアミド樹脂組成物およびその成形方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a xylylenediamine sebacamide-based polyamide resin composition with a quick rate of crystallization and excellent in molding efficiency. <P>SOLUTION: This polyamide resin composition contains a polyamide resin (A) obtained from xylylenediamine and sebacic acid, and a polyamide 66 (B), wherein the melting point of the polyamide 66 (B) is higher by more than 50°C than that of the polyamide resin (A), and further the temperature difference between the crystallization temperature of the polyamide resin (A) and that of the polyamide 66 (B) is 50°C or lower. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5625668(B2) 申请公布日期 2014.11.19
申请号 JP20100208713 申请日期 2010.09.17
申请人 发明人
分类号 C08L77/06;B29C45/00 主分类号 C08L77/06
代理机构 代理人
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