| 摘要 |
This wiring defect inspecting method for detecting a wiring short-circuited portion on a semiconductor substrate is characterized in performing: a pre-short-circuiting step of short-circuiting between terminals of wiring to be inspected; and a resistance value measuring step of determining, after the pre-short-circuiting step, whether there is the wiring short-circuited portion or not by measuring a resistance value of the wiring to be inspected. |
