| 摘要 |
PROBLEM TO BE SOLVED: To provide a film adhesive that can be excluded sufficiently from contact surface in electrical connection of a semiconductor chip with a circuit board using an adhesive, and can prevent the chip from crack because a load required for sufficient electric connection is low, hence can ensure excellent connection reliability, and to provide a semiconductor device using the same. SOLUTION: The film adhesive has a viscosity that amount to not more than 200 Pa s at any temperature of 50-250°C, and a cured product thereof has an average linear expansion coefficient of not more than 200 ppm/°C in the temperature range of 25-260°C. COPYRIGHT: (C)2012,JPO&INPIT |
