| 摘要 |
The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction. In the electronic device enclosure of the present invention, heat generated during an operating process of an electronic component inside the electronic device can be expelled out of the housing, and meanwhile, dust falling onto the electronic component inside the electronic device can further be reduced effectively, thereby ensuring normal operation of the electronic device and extending a service life of the electronic device. |
