发明名称 発光ダイオードパッケージ及びその製造方法
摘要 A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source.
申请公布号 JP5628274(B2) 申请公布日期 2014.11.19
申请号 JP20120275414 申请日期 2012.12.18
申请人 アドヴァンスト オプトエレクトロニック テクノロジー インコーポレイテッドADVANCED OPTOELECTRONIC TECHNOLOGY INC. 发明人 許 時淵;林 厚徳
分类号 H01L33/58 主分类号 H01L33/58
代理机构 代理人
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