发明名称 |
CHIP ON FLEX OPTICAL SUBASSEMBLY |
摘要 |
One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit. |
申请公布号 |
EP2802917(A1) |
申请公布日期 |
2014.11.19 |
申请号 |
EP20120857655 |
申请日期 |
2012.12.14 |
申请人 |
FINISAR CORPORATION |
发明人 |
STAPLETON, BRENT;DWIVEDI, RAJEEV;WALKER, YOUNG HAROLD JR.;LANDRY, GARY |
分类号 |
G02B6/43;G02B6/42 |
主分类号 |
G02B6/43 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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