| 发明名称 |
FLUX, SOLDER COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT MOUNTING SUBSTRATE |
| 摘要 |
Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from the group consisting of polybutadiene (meth)acrylate compounds represented by the following formula 1 and polybutadiene (meth)acrylate compounds represented by the following formula 2, and a hydrogenated dimer acid.
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR'=-H, or
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CH 3
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR'=-H, or
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CH 3 |
| 申请公布号 |
KR20140133512(A) |
申请公布日期 |
2014.11.19 |
| 申请号 |
KR20147021777 |
申请日期 |
2013.03.11 |
| 申请人 |
KOKI COMPANY LIMITED |
发明人 |
ARAI KENJI;FURUSAWA MITSUYASU;AOKI JUNICHI;TAKADA MAYUMI;NAKATSUMA MUNEHIKO |
| 分类号 |
B23K35/36;B23K35/363;H05K3/34 |
主分类号 |
B23K35/36 |
| 代理机构 |
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