发明名称 ウレタン樹脂組成物、硬化体及び光半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a urethane resin composition, a hardened body and an optical semiconductor device, which are excellent in heat resistance and thermal discoloration resistance.SOLUTION: The urethane resin composition includes (A) a polyol component and (B) a polyisocyanate component. The polyisocyanate component (B) contains 30 mass% or more, based on the total amount of the polyisocyanate component (B), of one or both of a bifunctional or trifunctional alicyclic polyisocyanate having at least one isocyanate group bonded to secondary carbon atom and a prepolymer with residual isocyanate group of the alicyclic polyisocyanate, and the ratio of the isocyanate group equivalent of the polyisocyanate component (B) to the hydroxy group equivalent of the polyol component (A) (isocyanate group equivalent/hydroxy group equivalent) is larger than 1.0 and 1.4 or less.
申请公布号 JP5626004(B2) 申请公布日期 2014.11.19
申请号 JP20110038381 申请日期 2011.02.24
申请人 日立化成株式会社 发明人 水谷 真人;富山 健男;鈴木 健司
分类号 C08G18/75;C08G18/61;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G18/75
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