| 摘要 |
An LED lamp radiating structure comprises a plastic shell (2) and a metal part (3) serve as heat dissipation bodies. The metal part (3) having a hollow structure is bonded with the plastic shell (2) after the plastic shell (2) undergoing injection molding. A baffle plate (31) is formed on the metal part (3). An LED chip (4) of the LED lamp is fixed below the baffle plate (31) to contact with the metal part (3) directly. The LED chip (4) is completely contacted with the metal part (3) through the baffle plate (31), therefore the heat dissipated from the LED chip (4) are conducted to the plastic shell (2) successfully, benefiting the heat dissipation of the LED chip (4). |
