发明名称 CHIP ON FILM INCLUDING DIFFERENT WIRING PATTERN, FLEXIBLE DISPLAY DEVICE THE SAME AND METHOD OF MANUFACTRUING OF FLEXIBLE DISPLAY DEVICE
摘要 <p>A chip on film according to an embodiment of the present invention comprises a base film; a semiconductor chip which is provided on the base film; and a wiring part which is provided on the base film and is electrically connected to the semiconductor chip. The wiring part includes a first area part and a second area part connected to the first area part. The intervals between wires arranged on the outermost portion of the first area part are different from the intervals between wires arranged on the outermost portion of the second area part.</p>
申请公布号 KR20140133106(A) 申请公布日期 2014.11.19
申请号 KR20130052723 申请日期 2013.05.09
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 IM, DAE HYUK
分类号 H01L21/60;H01L23/12;H05K1/02 主分类号 H01L21/60
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