| 摘要 |
<p>The present invention relates to a polishing pad which comprises: a plurality of first grooves that are provided in parallel at a predetermined interval in a surface to be polished; a plurality of second grooves that are provided in the surface to be polished to intersect with the first grooves; and a plurality of holes comprising a polishing liquid supply hole and a polishing liquid suction hole that are provided in bottom surfaces of the first groove and the second groove.</p> |
