发明名称 Printed wiring board and board module
摘要 A wiring board (20) includes a component-side patters (23) formed on a components mounting surface (22), a board-side pattern (25) is formed on a board mounting surface (24), a through hole via (26) electrically connecting the component-side pattern (23) and the board-side pattern (25). An electric insulation sheet (30) is adhered to the board mounting surface (24) to cover the through hole via (26) in the board mounting surface (24).
申请公布号 EP2804452(A2) 申请公布日期 2014.11.19
申请号 EP20140163650 申请日期 2014.04.07
申请人 PANASONIC CORPORATION 发明人 IWAO, SEIICHI;ASAKAWA, KOJI;IBUKI, YASUO;NISHIMURA, SHINJI;WATANABE, KAZUNORI
分类号 H05K3/28;H05K1/14;H05K1/18;H05K3/36 主分类号 H05K3/28
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