发明名称 |
Printed wiring board and board module |
摘要 |
A wiring board (20) includes a component-side patters (23) formed on a components mounting surface (22), a board-side pattern (25) is formed on a board mounting surface (24), a through hole via (26) electrically connecting the component-side pattern (23) and the board-side pattern (25). An electric insulation sheet (30) is adhered to the board mounting surface (24) to cover the through hole via (26) in the board mounting surface (24). |
申请公布号 |
EP2804452(A2) |
申请公布日期 |
2014.11.19 |
申请号 |
EP20140163650 |
申请日期 |
2014.04.07 |
申请人 |
PANASONIC CORPORATION |
发明人 |
IWAO, SEIICHI;ASAKAWA, KOJI;IBUKI, YASUO;NISHIMURA, SHINJI;WATANABE, KAZUNORI |
分类号 |
H05K3/28;H05K1/14;H05K1/18;H05K3/36 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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